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		<title>300mm SiC単結晶基板の開発に成功。大口径化で研削・研磨はどう変わる？</title>
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		<pubDate>Wed, 16 Sep 2026 04:15:21 +0000</pubDate>
				<category><![CDATA[研削研磨の業界ニュース]]></category>
		<category><![CDATA[300mmウエハー]]></category>
		<category><![CDATA[CMP]]></category>
		<category><![CDATA[SiC]]></category>
		<category><![CDATA[SiCウエハー]]></category>
		<category><![CDATA[ウエハー研削]]></category>
		<category><![CDATA[ウエハー研磨]]></category>
		<category><![CDATA[パワー半導体]]></category>
		<category><![CDATA[半導体]]></category>
		<category><![CDATA[炭化ケイ素]]></category>
		<category><![CDATA[研削]]></category>
		<category><![CDATA[研磨]]></category>
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					<description><![CDATA[<img width="300" height="200" src="https://www.kensaku-kenma.com/ymiymi/wp-content/uploads/2026/09/6b3a7479-9f85-4322-b4a6-3f0d6a45ef28-300x200.jpg" class="attachment-thumbnail size-thumbnail wp-post-image" alt="" decoding="async" fetchpriority="high" srcset="https://www.kensaku-kenma.com/ymiymi/wp-content/uploads/2026/09/6b3a7479-9f85-4322-b4a6-3f0d6a45ef28-300x200.jpg 300w, https://www.kensaku-kenma.com/ymiymi/wp-content/uploads/2026/09/6b3a7479-9f85-4322-b4a6-3f0d6a45ef28-1024x683.jpg 1024w, https://www.kensaku-kenma.com/ymiymi/wp-content/uploads/2026/09/6b3a7479-9f85-4322-b4a6-3f0d6a45ef28.jpg 1536w" sizes="(max-width: 300px) 100vw, 300px" /><p>株式会社レゾナックは2026年9月15日、直径300mm（12インチ）のSiC単結晶の成長および基板加工に成功したと発表しました。 現在主流の150mm（6インチ）に対して直径は2倍。同社では200mm（8インチ）のSi...</p>
<p>The post <a href="https://www.kensaku-kenma.com/%e6%a5%ad%e7%95%8c%e3%83%8b%e3%83%a5%e3%83%bc%e3%82%b9/sic%e3%82%a6%e3%82%a8%e3%83%8f%e3%83%bc%e3%81%8c%e3%81%a4%e3%81%84%e3%81%ab300mm%e3%81%b8%e3%80%82%e5%a4%a7%e5%8f%a3%e5%be%84%e5%8c%96%e3%81%a7%e7%a0%94%e5%89%8a%e3%83%bb%e7%a0%94%e7%a3%a8%e3%81%af">300mm SiC単結晶基板の開発に成功。大口径化で研削・研磨はどう変わる？</a> first appeared on <a href="https://www.kensaku-kenma.com">研削研磨.com</a>.</p>]]></description>
		
		
		
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